Aspen Tech has many components; what do they mean?
Thread Content
At Aspen Tech 2006, there were many application components such as ACOL, ADSIM, APLE, HIHR, HTFS+, HYSYS, Pipe Plus, TASC, and many others. What are the meanings and applications of these components? Does anyone have detailed documentation for Aspen 2006?
At Aspen Tech 2006, there were many application components such as ACOL, ADSIM, APLE, HIHR, HTFS+, HYSYS, Pipe Plus, TASC, and many others. What are the meanings and applications of these components? Does anyone have detailed documentation for Aspen 2006? Acol is short for Air Cooler, meaning air cooling. Adsim refers to absorption simulation; APALE and others are components within HTFS that are used for heat exchanger calculations. HTFS+ is a combined version of HTFS – HTFS will no longer be used in the future, and HTFS+ will be employed for heat exchanger calculations instead. HYSYS is the well-known software for this purpose; I’m not able to explain it further. TASC is also used for heat exchanger calculations. You can check the online help, as it explains everything in detail.