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Common knowledge on purchasing various types of seals - Epoxy modified one-component products 1 have a density ranging from 1.1 to 2.8, and the curing time is 50 degrees/4 hours or 110 degrees/30 minutes or 110 degrees/50 minutes； 2. It has moderate thixotropy and can be applied to the circuit board to cover and wrap electronic components. The glue can level itself but does not flow. It does not flow during the baking and curing process and maintains its original shape. ； 3 The cured product is black or amber bright, has strong adhesion to circuit boards and electronic components, and can withstand high temperatures of 200-300°C, strong acid and alkali corrosion, and various solvents. ； 4. High bonding strength, good heat resistance, and excellent solvent resistance. The bonding force can reach device damage, and the temperature resistance can also reach device damage. The cured product is not corroded by professional solvents, which can effectively protect circuits and electronic components and prevent leakage of internal technology of the device. ； 5. This product is suitable for confidential potting of electronic devices. After curing, it has strong solvent resistance and can withstand long-term immersion in organic solvents. ； Has extremely high heat distortion temperature and can resist high temperature damage ； It also has good hardness and wear resistance, and can resist the etching damage of general cutting tools. 6. Use this product to encapsulate electronic circuits, which has excellent anti-decryption properties. 7. This product is easy to use, has a long storage period, high bonding strength, fast curing speed, low shrinkage, and is non-toxic and harmless. 8. Store at room temperature for 70 days and in the refrigerator for more than half a year. Diepoxy modified two-component product is a two-component heat-curing potting material. After curing, it becomes a dense solid structure with high hardness, good heat resistance, extremely difficult to disassemble, and can play a role in protection, waterproofing, and confidentiality. 1 Product Features: 1) Good bonding strength and stable performance. 2) Low viscosity, good fluidity, no bubbles, and good toughness. 3) It has good processability, can be cured at room temperature or heated, and has fast curing speed and easy operation. 2 How to use: This product is divided into two components A and B, with a ratio of A : B is 100 : 40. When using, it is necessary to accurately weigh the two components A and B, stir them thoroughly to form a uniform mixture, and follow the curing conditions after pouring. 3 Curing conditions: 120 degrees/2 hours or 80 degrees/4-5 hours 4 Properties after curing: 1) Hardness: ＞80 2)Volume resistance: 2.6×1015Ω-cm 3)Surface resistance: 3.7×1013Ω 4) Breakdown voltage: 25kv/mm 5) Dielectric constant: 3.5 @ 1KHz 6) Dielectric loss: 0.02 7) Impact strength: >9.5kg/cm 8) Bending strength: >900kg/cm 5Transportation and storage: 1) Both components A and B need to be sealed and stored in a dry and cool place ； 2)The shelf life is one year ； 3) This product is not a dangerous product and can be stored and transported as general chemicals. In short, insulating resin is professionally used for the protection of electronic circuit modules. The cured product has a high-density solid structure and has high adhesion to PCB boards and electronic components. It also has good temperature resistance and solvent resistance. It can ensure that electronic circuits are not disassembled from three aspects: bonding, temperature resistance, and solvent resistance. It is an ideal choice for PCB electronic circuit module protection.