Should inspection be done first followed by polishing, or polishing first followed by inspection?
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For a type of separation container where the welds need to be ground to be level with the base material, is it feasible to arrange the production process so that inspection is carried out first and then grinding?
That’s not right, is it? The polishing process also has an impact!
During my internship at a chemical equipment manufacturing plant, I saw that their work procedure involved testing for defects first and then polishing. The specific standards have not been found yet; they will be uploaded once they are available.
Perform non-destructive testing first, and only after passing can it be polished. Because if grinding is done first and then imaging, since the weld is at the same level as the base material, the contrast between the weld and the base material on the film is very poor, which affects the quality of the image and makes it difficult to detect defects.
I agree with what was said on floor 5; that’s what we do as well.
In our unit, we first grind the surface before conducting flaw detection; it is necessary to remove surface defects such as pores, burrs, and spatter before flaw detection can be carried out effectively. But it must not affect the flaw detection personnel’s ability to identify the location of the welds.
In my opinion: inspect first, then polish.
Agree with the 7th floor – polish first, then conduct flaw detection.
Our factory’s workers prefer to conduct flaw detection first and then grinding, as this makes it easier to identify the areas that need repair. Polish after it meets the standards.
A type of separation container that allows for flaw detection before grinding, facilitating process planning and ensuring product quality!
In our factory’s quality control department for containers, it is stipulated that polishing should be done first followed by flaw detection; if flaw detection is carried out first and then polishing, it can affect the weld seams, leading to quality issues with those seams. It is better to polish first and then conduct flaw detection.
I think 1, grinding before flaw detection is to remove weld defects, and 2, grinding after flaw detection is a requirement of the manufacturing process
Containers of this type don’t seem to require this, right? Is there any fatigue stress? If so, then it’s better to grind them first and then conduct flaw detection, as that is beneficial for the detection process.
The products delivered are those that have been polished; to ensure that the photographic negative matches the actual product, polishing must be carried out first, followed by flaw detection.
From a design perspective, equipment manufacturing is based on the quality of the final product. Grinding can first remove surface defects that would require unnecessary rework, thereby reducing manufacturing costs (although internal defects may increase production expenses). It also facilitates soldering and ensures good photo quality. Of course, this is a matter related to the manufacturing process; the manufacturer can decide based on its own experience and procedures. The most important thing is to minimize the manufacturing costs while ensuring quality.
It seems there’s a rule: grinding welds is strictly prohibited before filming. It is probably to prevent the concealment of welding defects.
Can you remember where exactly it is specified? I really want to find out; I’m facing this problem right now.
150 Section 10.8.1 stipulates that for the welded joints of containers, after passing inspections for shape, dimensions, and appearance, non-destructive testing as specified in this section shall be carried out. If required, conducting flaw detection without grinding would not comply with this provision, right?