Silicon core drawing: Relationship between doping level and resistivity
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Help ------ Silicon core drawing: Relationship between doping level and resistivity
Based on semiconductor properties: the more doping (limited to groups 3 and 5), the lower the resistivity.
First, based on the resistivity of the rod material, its type, and the desired resistivity of the silicon core to be drawn, the amount of doping required is calculated. Spraying is generally done using B or P solutions.
I agree with the view above; when applying the coating, it is crucial to match it to the conductivity type of the original silicon core. For example, phosphorus pentoxide is generally used for N-type cores.
The purpose of doping is to reduce the resistivity of the silicon core and shorten its breakdown time, thereby counteracting the effects of the re-deposition reaction. For N-type materials, a coating made from phosphorus pentoxide and ethanol solution can be applied to the surface of the silicon core. As for P-type materials, no suitable doping agent has yet been found; I would appreciate any advice on this matter!
If B is to be added, what is used for that? If anyone knows, please let me know! Thank you! !
May I ask: is the spraying done on the surface of the already drawn silicon core? Is doping still carried out inside the single-crystal furnace? Also, how exactly is spraying done? Could you be more specific? Urgent! Thank you so much! !
Is it done by spraying on the surface of the drawn silicon core? Is doping still carried out inside the single-crystal furnace? Also, how exactly is spraying done? Could you be more specific? Urgent! Thank you so much! !
Is it done by spraying on the surface of the drawn silicon core? Is doping still carried out inside the single-crystal furnace? Also, how exactly is spraying done? Could you be more specific? Urgent! Thank you so much! !
This is a post from 2011; it’s likely that no one uses this method anymore. Back then, it was applied to the surface of round silicon cores in order to speed up the breakdown time
It is applied to the silicon core raw material rod and then drawn. What other use is there for this process?