Electronic grade bisphenol F epoxy resin: The demand for low ions and low chlorine is rising, and domestic substitution is accelerating.

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Electronic grade bisphenol F epoxy resin is a high-end special epoxy resin synthesized from bisphenol F and epichlorohydrin through refining, ionization and deep dechlorination processes. It has the characteristics of low crystallization, high insulation, resistance to moisture and heat, and low dielectric loss. It can effectively avoid problems such as electromigration, metal corrosion, and insulation failure in the long-term service of semiconductors and power devices. It is a key basic material for high-end manufacturing of electronic information and new energy. 2. The mainstream synthesis process of production technology is: Addition and condensation of bisphenol F and epichlorohydrin → ring closing reaction → dealcoholization and acid removal → multi-stage vacuum distillation → molecular distillation and refining → ultrapure water circulation to remove ions → ultra-clean precision filtration finished product. The difficulty of the process lies in the deep removal of hydrolyzable chlorine and inorganic metal ions. Ordinary general epoxy production processes cannot meet the control standards of ppb-level ions and ppm-level chlorine. Overseas, Mitsubishi Chemical of Japan, Kokudo Chemical of South Korea, and Hexion of the United States have long monopolized the high-end market. ； Domestic companies such as Nantong Xingchen, Hongchang Electronics, Huayi Resin, and Kangda New Materials have achieved stable mass production. 3. Main application fields 1. Conductor field, used for EMC epoxy plastic encapsulant, BGA/CSP underfill, IGBT and SiC power device potting insulation, adapting to the packaging needs of advanced process chips and third-generation semiconductors ； 2. In the field of high-frequency and high-speed PCB, it is used in 5G base stations, servers, and AI computing power motherboard substrates to meet high-frequency signal transmission requirements with its low dielectric and low loss characteristics. ； 3. In the field of new energy vehicles, it is suitable for potting protection of electronic control modules, battery packs and BMS modules, with outstanding high and low temperature resistance, waterproof and flame retardant properties. ； 4. Other fields, including wind turbine blade matrix resin, high-temperature resistant special adhesives, electronic three-proof coatings, carbon fiber composite matrix, etc. 4. Market Scale and Growth Trends In 2025, the domestic electronic grade bisphenol F epoxy resin market will be 2.2-2.5 billion yuan, a year-on-year increase of 12%-25%. Benefiting from the expansion of semiconductor packaging, high-frequency and high-speed PCB iterations, and the increased volume of new energy automotive electronics, the industry maintains a high degree of prosperity. As the downstream advanced processes, power semiconductors, and new energy industries continue to expand, the domestic market size is expected to reach 3.8-12 billion yuan in 2030, with the industry growth rate maintaining 12%-15% ； The scale range span is mainly driven by factors such as the accelerated penetration of high-end ultrapure products and higher-than-expected downstream demand. 5. Main manufacturers and production capacity 1. Domestic manufacturer Nantong Xingchen: Existing electronic grade production capacity of 12,000 tons/year Huayi Resin: Existing production capacity 10,000 tons/year Hongchang Electronics: Existing production capacity: 8,000 tons/year Kangda New Materials: Existing production capacity: 5,000 tons/year ； Jiangsu Sanmu, Shengquan Group, Huitian New Materials and other companies have a total production capacity of 5,000 tons/year. 2. Overseas suppliers Japan's Mitsubishi Chemical, South Korea's Guodu Chemical, and the United States' Hexion mainly import sub-packaging, with a total supply scale of about 7,000 tons/year, focusing on the field of high-end advanced process packaging. 3. Planned production capacity. The total domestic production capacity of electronic-grade bisphenol F epoxy resin in 2025 is about 45,000 tons/year, with a capacity utilization rate of 85%-90%. The supply of high-end specifications is tight and the dependence on imports is high. From 2026 to 2030, companies will focus on deploying high-end production lines, and Nantong Xingchen, Huayi New Materials, Kangda New Materials, etc. will gradually add production capacity. It is expected that the total domestic production capacity will reach 95,000 tons/year in 2030, and import dependence will drop significantly. 6. Market Supply and Demand and Price Profitability The current industry is characterized by tight high-end supply and overcapacity in mid- and low-end products. The production capacity of ordinary industrial-grade products is sufficient, but there is still a market gap for electronic-grade products, and some high-end brands rely on imports. The gross profit margin of the electronic-grade bisphenol F epoxy resin industry is much higher than that of general-purpose epoxy resin. The cost is mainly affected by the energy consumption of bisphenol F monomer, epichlorohydrin raw materials and refining process. With the subsequent release of large-scale production capacity, production costs are expected to be steadily optimized. 7. Industry development trends 1. Domestic substitution continues to accelerate, the core indicators of domestic enterprises have reached international levels, gradually replacing imports from Japan and South Korea, and the pace of certification implementation in the fields of semiconductors and power devices has accelerated. ； 2. Products are iterating towards ultra-pure and high-end products, and downstream advanced process chips drive the industry to upgrade to higher specifications. ； 3. Applications continue to expand, extending from traditional electronic packaging and PCB to new energy automotive electronics, wind power composite materials, high-end electronic adhesives and other fields, supporting the long-term stable growth of the industry ；