Announcement on Jiangsu Hefu New Materials’ 30,000-ton resin project for electronic packaging materials

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Public announcement regarding the project for 30,000 tons of resin used in electronic packaging. Recently, a public announcement was made regarding the safety assessment of Jiangsu Hefu New Materials Technology Co., Ltd.’s project to produce 30,000 tons of advanced electronic packaging materials per year. The project requires an investment of 350 million yuan. Specifically, it involves the production of 10,000 tons per year of resins for special electronic packaging materials, 12,000 tons per year of resins for high-purity electronic packaging materials, and 8,000 tons per year of resins specifically designed for silane coupling agents. As a by-product of this production process, 10,000 tons per year of industrial sodium chloride are generated. The relevant production process technologies are owned by Shanghai Hefu New Materials Technology Co., Ltd. The products have been manufactured for many years, and their process technologies and production methods are mature and reliable. The chemicals involved in the production process of this project include: the solvent-based biphenyl-type phenolic resin product HF-3000 M75 for electronic packaging, the solvent-based linear phenol-formaldehyde resin product HF-8011 A80, the solvent-based linear phenol-formaldehyde resin product HF-8011 M80, and allyl glycidyl ether, among others.