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I am a senior student majoring in Chemical Engineering and Technology, currently working on my graduation project, which involves using the data packages provided by Aspen Plus to conduct property simulation analyses of MDEA-CO2-H2O. I have encountered some issues, and I would like to ask fellow users the following: 1. How can the partial pressure of carbon dioxide in the gas phase of the VLE MDEA-CO2-H2O system be determined through simulation? Is sensitivity analysis feasible? (Aspen comes with its own data packets for simulation) ? 2. How is the heat of carbon dioxide absorption by amine solutions obtained? What is process simulation analysis? Thank you so much!
Wouldn’t it be better to use Aspen Hysys for simulation? Hysys is more suitable for gas treatment; the DBR Amine property package in Hysys incorporates the K-E equation, experimental data, and industrial parameters, resulting in relatively reliable simulation outcomes
I haven’t checked to what extent the calculation results using the amine packages in Aspen match those of the actual device
Thank you for your support and help. The teacher said to use Aspen Plus to run a simulation and see the results. But I don’t know how to simulate the heat of absorption and the carbon dioxide pressure under gas-liquid equilibrium conditions in that module; I would be very grateful if you could explain it in detail.
Yes, it’s the amine envelope calculation; for other physical properties, there are modules available to carry out the calculations and obtain results. Although there are some discrepancies with the experimental data, the overall results are still fairly consistent. It’s that there are no modules available to handle the heat of absorption and the carbon dioxide pressure at gas-liquid equilibrium. The variable is the load of carbon dioxide, while the target variable is the change in heat of absorption under a certain amine solution; ultimately, a curve is obtained. I hope the moderator will kindly offer some guidance.
Has it been resolved? The original poster, please add your contact information so we can communicate; I’m also working on something similar these days