【Ten Years of Rapid Development in Chemical Equipment】2115–2014: Filling the Gap! “Granular epoxy molding compound for fan-out board-level packaging ”

Thread Content

Give praise and encouragement to the achievements made in China’s chemical engineering technology and equipment; your participation in discussions is the greatest encouragement. **********************【Ten Years of Great Development in Chemical Engineering Equipment】Regular updates and summaries are available; feel free to join the discussions at https://bbs.hcbbs.com/thread-3576046-1-1.html (Source: Haichuan Chemical Industry Forum Website) ***************** On November 25, 2024, the China Electronic Materials Industry Association organized an evaluation meeting for the technological achievement of “granular epoxy molding compound for fan-out board-level packaging (KHG900G-A)”, which was developed by Jiangsu Zhongke Kehua New Materials Co., Ltd. (hereinafter referred to as “Zhongke Kehua”). After inquiries, discussions and other procedures, the evaluation committee unanimously agreed that the Zhongke Kehua granular epoxy molding compound (KHG900G-A) can be used for encapsulating fan-out board-level packaging products; its performance meets the advanced standards of similar international products, filling a gap in China’s market. After a thorough review, the appraisal committee agreed that the project on \"Granular epoxy molding compound for fan-out board-level packaging (KHG900G-A)\\" has passed the appraisal for scientific and technological achievements. The resulting product, the granular epoxy molding compound (GMC), is primarily used in wafer-level packaging (WLP) and board-level packaging (PLP) that employ the compress molding process, especially fan-out board-level packaging (FOPLP). This product features a high Tg value, low stress, low warping, and high reliability. A granulation system developed through independent design enables the production of product particles with appropriate particle sizes. It has been tested by various customers including China Resources Microelectronics Chongqing Xipan Microelectronics Company, Riyue Xin (Suzhou) Company, and Hefei Simai Microelectronics Company; some of these customers have already begun receiving bulk deliveries. Public information shows that Zhongke Kehua was established in 2011, focusing on the production of epoxy molding compounds for semiconductor packaging. The company’s predecessor was Jiangsu Kehua; it was founded by Beijing Kehua New Materials Technology Co., Ltd., which is controlled by the Institute of Chemistry of the Chinese Academy of Sciences. Following the shareholding reform in 2022, nearly a dozen strategic investors were brought in, including Sinochem Capital under Sinochem Group and CAS National Science Investment from the Chinese Academy of Sciences. In terms of production capacity, the company currently has 8 epoxy molding compound production lines, with an annual output of over 18,000 tons. Just last September, the second phase of the company’s epoxy molding compound production project came online. With a total investment of 520 million yuan, this phase involved the construction of 12 production lines for epoxy molding compounds, resulting in an annual production capacity of 30,000 tons. In July this year, Jiangsu Zhongke Kehua New Materials Co., Ltd. submitted an application for IPO guidance and registration with the Jiangsu Securities Regulatory Bureau, and is set to launch its IPO!