The Hefei headquarters of Hui’s New Materials and its adhesive materials production facility have officially commenced construction

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The construction of Hui’s New Materials’ headquarters in Hefei and its adhesive materials production facility officially began. On March 16, the groundbreaking ceremony for this project was held in Hefei High-Tech Zone. With a total investment of 658 million yuan, this project will serve as an important milestone in China’s adhesive materials sector, providing essential domestically produced materials to support key industries such as semiconductor packaging and testing, as well as new energy batteries. Project timeline: December 5, 2025: The Hefei Ecology and Environment Bureau issued the first public notice regarding the environmental impact assessment, specifying that the project will serve as a \"headquarters plus R&D and production base for adhesive materials.\" The planned land area is 47.34 mu, with an annual production capacity of 50 million square meters of functional coating products and 20 tons of special adhesive resins. 2026.01.28: The Management Committee of Hefei High-Tech Zone announced that the project had secured the land grant and would be established there officially. The total investment in the project is 658 million yuan (with fixed asset investment of ≥450 million yuan), and the total construction area is approximately 60,000 square meters. Eight advanced production lines will be established, and upon reaching full operation, it is expected to generate an annual output value of 600 million yuan and annual tax revenues of 24 million yuan. 2026.03.16: The project officially commenced construction, entering the substantive construction phase. It is reported that this project is mainly engaged in the research, development, and production of functional coating products, with an planned annual production capacity of 50 million square meters. The products are widely used in fields such as new energy batteries (insulation, impact resistance, etc.), semiconductor packaging and testing (wafer grinding, dicing, etc.), optical component manufacturing (lens protection, etc.), and consumer electronics (lighting, fixation, etc.).