The issue of surface activity.
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We are conducting an experiment to use HF, hydrogen peroxide, pure water, and metal ions to induce a catalytic reaction on the surface of silicon. After a certain number of batches, bubbles will adhere to the surface of the silicon wafers. Is there any way to reduce the attachment of bubbles? I hope everyone can help provide guidance.
As for how to implement it specifically, some methods have an impact; you should look up relevant information, gather the methods that have been used, search for and compare raw materials, methods, conditions, and so on