How to understand \"equipotential bonding for the use of safety instrumented systems\"?
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Clause 5.0.17 of standard GB/T 50770-2013 stipulates that the grounding of safety instrumented systems shall adopt an equipotential bonding method. How to understand it?
I think what this means is that grounding should be done to a single ground point, rather than grounding each point separately (as different grounds have potential differences).
My understanding is that the safety instrument system is connected to the MEB of the low-voltage power distribution system, provided that the low-voltage power distribution system uses a common equipotential bonding (MEB) for grounding.
First understand ‘equipotential bonding’, and then you will understand the use of equipotential bonding in safety instrumented systems. Equipotential bonding involves connecting the building’s rebar mesh, electrical grounds, etc. together, and then grounding them at one point. The fundamental principle is that if the ‘ground potential’ is raised, it will be raised uniformly, without any difference in ground potential arising.