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Diagnosis methods for float level gauge failures

2015-07-06View Original

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As times continue to evolve, industrial production places ever higher, newer, and more stringent demands on the instruments used. These requirements include faster speeds, greater sensitivity, improved stability, easier operation, lower costs, and reduced environmental impact. Among level measurement instruments, the float level gauge is a simple yet practical device that is widely used. Float level gauges often exhibit intermittent performance issues during operation, and in most cases such problems are caused by poor contact or weak soldering; in such situations, the method of tapping or applying pressure can be used to resolve the issue. This method involves gently tapping the plug-in board or components with a small rubber tip or another striking object to see if it causes errors or shutdown failures. The so-called “manual pressing” involves, when a fault occurs, turning off the power supply and then manually pressing the connected components, as well as the plugs and sockets, firmly together, before turning the power on again to see if the fault is resolved. If it is found that tapping the casing works normally but stops working when tapped again, it is best to reseat all connectors firmly before trying again; if that still fails, then other methods will have to be employed. Secondly, the observation method can be used; the so-called observation method involves making use only of vision, smell, and touch. Sometimes, damaged components will change color, develop bubbles, or show burnt spots ; Burnt components emit a distinctive odor ; Short-circuited chips will get hot ; Solder defects or poor soldering can be observed with the naked eye. The replacement method involves having two float level gauges of the same model, or sufficient spare parts, so that a good spare part can be used to replace the corresponding component in the faulty unit, in order to determine whether the fault is resolved. There is also the cooling method. Due to the high ambient temperatures in summer, coupled with long working hours, certain faults can occur. When such faults arise, how can we cool down the system? This phenomenon is caused by the poor performance of individual ICs or components, with their high-temperature performance parameters failing to meet the specified requirements. To determine the cause of the fault, the temperature rise and fall method can be used. The so-called cooling method involves, when a fault occurs, using cotton fibers to apply anhydrous alcohol to the area where the fault might be present in order to cool it down, and then checking whether the fault is resolved. By \"raising the temperature,\" it means artificially increasing the ambient temperature; for example, using a soldering iron to heat the suspicious area (be careful not to raise the temperature too much, as this could damage normal components) to see if the fault occurs. The above are some common methods for detecting instrument faults; mastering one or two of them will ensure that you’re not at a loss when faced with problems. Generation after generation, new instruments have been developed, which in turn has provided strong impetus for the advancement of instrumentation technology and related industries, serving as the material, intellectual, and technical foundation for further development in this field.

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