The amount of gel added to the electrolyte, copper concentration, current density, etc., during the electrowinning of copper
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Regarding factors such as the amount of gel added to the electrolyte during copper electrowinning, copper concentration, and current density, I hope everyone will feel free to share their opinions
I’m very interested in learning more about this, and I hope those with more experience can share their knowledge with me.
The amount of adhesive and the copper ion concentration are related to the operating current density, and the control parameters vary under different current densities
There are also many influencing factors such as the composition of the electrolyte, its flow rate, and the circulation method
When the electrolyte temperature, current density, and copper ion concentration increase, the amount of glue should be increased appropriately